Nxp Usa Inc
Bill of Lading Import Records
Address and Contact Info
- NXP USA INC
6501 WILLIAM CANNON DRIVE WEST AUSTIN TX 78735 US
- NXP USA, INC.
6501 WILLIAM CANNON DR. AUSTIN TX 78735 US - NXP USA, INC.
6501 WILLIAM CANNON DR. AUSTIN, TX AUSTIN TX 78735 US - NXP USA, INC.
6501 WILLIAM CANNON DR. WEST AUSTIN TX 78735 US - NXP USA INC
6501 WILLIAM CANNON DR WEST AUSTIN TX 78735 US
- +15129136786 [Telephone Number, NXP USA INC]
A summary of customers, suppliers, and logistics partners for the latest 14 U.S. imports by Nxp Usa Inc are presented below. In total, 14 import manifest records have been entered for Nxp Usa Inc since January 2018. Click the shipment ID for full Bill of Lading information.
Suppliers
| ADVANCED SEMICONDUCTOR ENGINEERING | TAOYUAN TW | 5 |
| FREESCALE SEMICONDUCTOR(CHINA) | TIANJIN CN | 3 |
| FREESCALE SEMICONDUCTOR MALAYSIA | EHSAN MY | 2 |
| TOKYO ELECTRON LIMITED | TOKYO JP | 2 |
| AMKOR TECHNOLOGY TAIWAN LTD. | HSINCHU | 1 |
| STATS CHIPPAC PTE LTD | SINGAPORE SI SG | 1 |
Shipments [click ID for full details]
| Shipment ID | Supplier Notified Party [Logistics] | Receiver / Consignee |
|---|---|---|
| 202009155487 | FREESCALE SEMICONDUCTOR MALAYSIA NO.2 JALAN SS8/2, FREE INDUSTRIAL Departure Port Port Swettenham,Malaysia |
NXP USA INC 6501 WILLIAM CANNON DRIVE WEST Los Angeles, California Arrival Port |
| EISU9296172 [1] | - pcs EMPTY WAFER CONTAINER HARM.SYS.CODE:392310 | 2020-08-28 |
| 2020082926688 | FREESCALE SEMICONDUCTOR MALAYSIA NO.2 JALAN SS8/2, FREE INDUSTRIAL Departure Port Port Swettenham,Malaysia |
NXP USA INC 6501 WILLIAM CANNON DRIVE WEST Los Angeles, California Arrival Port |
| EISU9296172 [1] | - pcs EMPTY WAFER CONTAINER HARM.SYS.CODE:392310 | 2020-08-28 |
| 2019071231477 | TOKYO ELECTRON LIMITED 5-3-1 AKASAKA Departure Port Pusan,South Korea |
NXP USA INC 6501 WILLIAM CANNON DR WEST Los Angeles, California Arrival Port |
| CRSU9177035 [1] | 6 pcs LTPZ200 | 2019-07-03 |
| NYKU5252766 [1] | 6 pcs LTPZ200 | 2019-07-03 |
| TRIU0800900 [1] | 3 pcs LTPZ200 | 2019-07-03 |
| TTNU0613567 [1] | 2 pcs LTPZ200 | 2019-07-03 |
| 2019070467716 | TOKYO ELECTRON LIMITED 5-3-1 AKASAKA Departure Port Pusan,South Korea |
NXP USA INC 6501 WILLIAM CANNON DR WEST Los Angeles, California Arrival Port |
| CRSU9177035 [1] | 6 pcs LTPZ200 | 2019-07-03 |
| NYKU5252766 [1] | 6 pcs LTPZ200 | 2019-07-03 |
| TRIU0800900 [1] | 3 pcs LTPZ200 | 2019-07-03 |
| TTNU0613567 [1] | 2 pcs LTPZ200 | 2019-07-03 |
| 2019021516561 | ADVANCED SEMICONDUCTOR ENGINEERING INC. (CHUNG-LI) BRANCH #550, CHUNG- Departure Port Kaohsiung,China (Taiwan) |
NXP USA, INC. 6501 WILLIAM CANNON DR. Tacoma, Washington Arrival Port |
| EMCU5321171 [1] | - pcs IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) LEAD FRAME WITHOUT MOLDING COMPOUND 3 PALLETS = 10 DRUMS | 2019-02-03 |
| 2019020439829 | ADVANCED SEMICONDUCTOR ENGINEERING INC. (CHUNG-LI) BRANCH #550, CHUNG- Departure Port Kaohsiung,China (Taiwan) |
NXP USA, INC. 6501 WILLIAM CANNON DR. Tacoma, Washington Arrival Port |
| EMCU5321171 [1] | 11 pcs IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) LEAD FRAME WITHOUT MOLDING COMPOUND 3 PALLETS = 11 DRUMS | 2019-02-03 |
| 2018102327628 | STATS CHIPPAC PTE LTD 5 YISHUN STREET 23 Departure Port Singapore,Singapore |
NXP USA, INC. 6501 WILLIAM CANNON DR. Tacoma, Washington Arrival Port |
| TLLU5688696 [1] | 6 pcs SCRAPPED INTEGRATED CIRCUITS, WAFER SKELETON | 2018-10-22 |
| 2018072836317 | AMKOR TECHNOLOGY TAIWAN LTD. NO.11, GUANGFU RD., HSINCHU Departure Port Kaohsiung,China (Taiwan) |
NXP USA, INC. 6501 WILLIAM CANNON DR. Tacoma, Washington Arrival Port |
| TCLU1222485 [1] | 25 pcs LOT 31: PROBE WAFER WITH DIE (BROKEN) LOT 33: BLUE TAPE (MYLAR) WITH OR WITHOUT DIE LOT 33B: SCRAP DIE (INKED) LOT 39: SUBSTRATE OF BGA | 2018-07-27 |
| 2018052829281 | FREESCALE SEMICONDUCTOR(CHINA) LIMITED NO.15,XING HUA ROAD,XIQING Departure Port Xingang,China (Mainland) |
NXP USA INC 6501 WILLIAM CANNON DRIVE WEST Los Angeles, California Arrival Port |
| TCLU7972656 [1] | - pcs WAFER BOX | 2018-05-27 |
| 2018050915292 | FREESCALE SEMICONDUCTOR(CHINA) LIMITED NO.15,XING HUA ROAD,XIQING Departure Port Pusan,South Korea |
NXP USA INC 6501 WILLIAM CANNON DRIVE WEST Los Angeles, California Arrival Port |
| TEMU8048161 [1] | - pcs WAFER BOX | 2018-05-08 |
| 2018050528387 | ADVANCED SEMICONDUCTOR ENGINEERING INC. (CHUNG-LI) BRANCH #550, CHUNG- Departure Port Kaohsiung,China (Taiwan) |
NXP USA, INC. 6501 WILLIAM CANNON DR. Tacoma, Washington Arrival Port |
| EMCU5278389 [1] | 15 pcs IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) 4 PALLETS = 15 DRUMS HS CODE:8542.90 | 2018-04-20 |
| 2018042474349 | ADVANCED SEMICONDUCTOR ENGINEERING INC. (CHUNG-LI) BRANCH #550, CHUNG- Departure Port Kaohsiung,China (Taiwan) |
NXP USA, INC. 6501 WILLIAM CANNON DR. Seattle, Washington Arrival Port |
| EMCU5278389 [1] | 15 pcs IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) 4 PALLETS = 15 DRUMS HS CODE:8542.90 | 2018-04-20 |
| 2018030137946 | FREESCALE SEMICONDUCTOR(CHINA) LIMITED NO.15,XING HUA ROAD,XIQING Departure Port Xingang,China (Mainland) |
NXP USA INC 6501 WILLIAM CANNON DRIVE WEST Los Angeles, California Arrival Port |
| FSCU5690905 [1] | - pcs WAFER BOX | 2018-02-28 |
| 2018021929038 | ADVANCED SEMICONDUCTOR ENGINEERING INC. (CHUNG-LI) BRANCH #550, CHUNG- Departure Port Kaohsiung,China (Taiwan) |
NXP USA INC 6501 WILLIAM CANNON DRIVE WEST Tacoma, Washington Arrival Port |
| EITU1721617 [1] | 19 pcs IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) (LOT#243)LEAD FRAMES, WITHOUT MOLDING COMPOUND, CO LOAD BOARD(LOT #38) | 2018-02-17 |
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