Advanced Semiconductor Engineering → Nxp Usa, Inc.

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by NXP USA, INC.. This shipment is registered as coming from ADVANCED SEMICONDUCTOR ENGINEERING via Kaohsiung,China (Taiwan). Manifest records show a quanitity of 15 CTN with a total weight of 2062 Kilograms arrived on 2018-04-20 via the vessel EVER UNITED to the port of Seattle, Washington. Cargo includes products identified as ic device w/ encapsulation, plastic (lot#01) blue tape (mylar) with or without die (lot#33) 4 pallets = 15 drums hs code:8542.90.

Cargo Details
Consignee
NXP USA, INC.
6501 WILLIAM CANNON DR.
AUSTIN TX 78735 US
Shipper
ADVANCED SEMICONDUCTOR ENGINEERING
INC. (CHUNG-LI) BRANCH #550, CHUNG-
-HWA ROAD, SEC.1, CHUNG-LI CITY
TAOYUAN TW
Notify Party
NXP USA, INC.
6501 WILLIAM CANNON DR.



AUSTIN TX 78735 US
Vessel and Port
Carrier CodeMLCW
VesselEVER UNITED [SG]
Departure PortKaohsiung,China (Taiwan)
Landing PortSeattle, Washington
Manifest Qty15 CTN
Manifest Weight2062 Kilograms
Manifest Dimension0
Place of ReceiptKEELUNG
Conveyance IDEVER UNITED [Conveyance Name]
Transportation ModeVessel, containerized
Arrival Date2018-04-20
Notified Parties
  • EGLV

Container Cargo Description
Container #PiecesDescription
EMCU527838915IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) 4 PALLETS = 15 DRUMS HS CODE:8542.90
EMCU5278389890098734 NXP/ECOTECH 1 OF 4 (IN DIA.) MADE IN TAIWAN - DO - 2 OF 4 - DO -
EMCU52783893 OF 4 - DO - 4 OF 4

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
EGLV003800997136MLCWTPEH10006720 () 0157EHouse Bill382682018-04-23 / 2018-04-24


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