Advanced Semiconductor Engineering → Nxp Usa Inc

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by NXP USA INC. This shipment is registered as coming from ADVANCED SEMICONDUCTOR ENGINEERING via Kaohsiung,China (Taiwan). Manifest records show a quanitity of 19 DRM with a total weight of 2402 Kilograms arrived on 2018-02-17 via the vessel ITAL UNICA to the port of Tacoma, Washington. Cargo includes products identified as ic device w/ encapsulation, plastic (lot#01) blue tape (mylar) with or without die (lot#33) (lot#243)lead frames, without molding compound, co load board(lot #38).

Cargo Details
Consignee
NXP USA INC
6501 WILLIAM CANNON DRIVE WEST
AUSTIN TX 78735 US
Shipper
ADVANCED SEMICONDUCTOR ENGINEERING
INC. (CHUNG-LI) BRANCH #550, CHUNG-
-HWA ROAD, SEC.1, CHUNG-LI CITY
TAOYUAN TW
Notify Party
NXP USA INC
6501 WILLIAM CANNON DRIVE WEST



AUSTIN TX 78735 US
Vessel and Port
Carrier CodeMLCW
VesselITAL UNICA [IT]
Departure PortKaohsiung,China (Taiwan)
Landing PortTacoma, Washington
Manifest Qty19 DRM
Manifest Weight2402 Kilograms
Manifest Dimension0
Place of ReceiptKAOHSIUNG
Conveyance IDITAL UNICA [Conveyance Name]
Transportation ModeVessel, containerized
Arrival Date2018-02-17
Notified Parties
  • EGLV

Container Cargo Description
Container #PiecesDescription
EITU172161719IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) (LOT#243)LEAD FRAMES, WITHOUT MOLDING COMPOUND, CO LOAD BOARD(LOT #38)
EITU1721617AS PER SHIPPERS INVOICE

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
EGLV003800269581MLCWTPEH10006400 () 0146EHouse Bill24382018-01-26 / 2018-02-19


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