Advanced Semiconductor Engineering → Nxp Usa, Inc.

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by NXP USA, INC.. This shipment is registered as coming from ADVANCED SEMICONDUCTOR ENGINEERING via Kaohsiung,China (Taiwan). Manifest records show a quanitity of 11 DRM with a total weight of 1190 Kilograms arrived on 2019-02-03 via the vessel EVER STEADY to the port of Tacoma, Washington. Cargo includes products identified as ic device w/ encapsulation, plastic (lot#01) blue tape (mylar) with or without die (lot#33) lead frame without molding compound 3 pallets = 11 drums.

Cargo Details
Consignee
NXP USA, INC.
6501 WILLIAM CANNON DR.
WEST
AUSTIN TX 78735 US
Shipper
ADVANCED SEMICONDUCTOR ENGINEERING
INC. (CHUNG-LI) BRANCH #550, CHUNG-
-HWA ROAD, SEC.1, CHUNG-LI CITY
TAOYUAN TW
Notify Party
NXP USA, INC.
6501 WILLIAM CANNON DR.
WEST


AUSTIN TX 78735 US
Vessel and Port
Carrier CodeMLCW
VesselEVER STEADY [PA]
Departure PortKaohsiung,China (Taiwan)
Landing PortTacoma, Washington
Manifest Qty11 DRM
Manifest Weight1190 Kilograms
Manifest Dimension0
Place of ReceiptKEELUNG,TAIWAN
Conveyance IDEVER STEADY [Conveyance Name]
Transportation ModeVessel, containerized
Arrival Date2019-02-03

Container Cargo Description
Container #PiecesDescription
EMCU532117111IC DEVICE W/ ENCAPSULATION, PLASTIC (LOT#01) BLUE TAPE (MYLAR) WITH OR WITHOUT DIE (LOT#33) LEAD FRAME WITHOUT MOLDING COMPOUND 3 PALLETS = 11 DRUMS
EMCU5321171890109197 NXP/ECOTECH Q'TY: 370.98 KG 1 OF 3 (IN DIA.) MADE IN TAIWAN - DO - Q'TY: 363.54 KG
EMCU53211712 OF 3 - DO - Q'TY: 187.7 KG 3 OF 3

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
EGLV003900100189MLCWTPEH10008071 () 0196EHouse Bill19192019-01-13 / 2019-02-04


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