Hysol Huawei Electronics Co., Ltd. → Infineon Technologies Asia Pacific

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by INFINEON TECHNOLOGIES ASIA PACIFIC. This shipment is registered as coming from HYSOL HUAWEI ELECTRONICS CO., LTD. via Tsingtao,China (Mainland) with logistic notifications handled by INFINEON TECHNOLOGIES AMERICAS CORP. Manifest records show a quanitity of 5 PKG with a total weight of 3184 Kilograms arrived on 2020-09-24 via the vessel CSCL AUTUMN to the port of Los Angeles, California. Cargo includes products identified as epoxy molding compound.

Cargo Details
Consignee
INFINEON TECHNOLOGIES ASIA PACIFIC
101 N SEPULVEDA BLVD
2234 N. BELLFLOWER BLVD.
EL SEGUNDO CA 90245 US
Shipper
HYSOL HUAWEI ELECTRONICS CO., LTD.
SONGTIAO HI-TECH INDUSTRIAL DEVELOP
MENT ZONE
LIANYUNGANG CN
Notify Party
INFINEON TECHNOLOGIES AMERICAS CORP
PROLONGACION AV DE IOS CABOS NO 923
4
PARQUE INDUSTRIAL PACIFICO

TIJUANA MX
Contact Details: [email protected] [e-Mail Address]
Vessel and Port
Carrier CodeDFDS
VesselCSCL AUTUMN [HK]
Departure PortTsingtao,China (Mainland)
Landing PortLos Angeles, California
Manifest Qty5 PKG
Manifest Weight3184 Kilograms
Manifest Dimension0 Cubic Meters
Place of ReceiptQINGDAO LIUTING I
Conveyance ID9645891 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2020-09-24
Notified Parties
  • OOLU

Container Cargo Description
Container #PiecesDescription
OERU41004135EPOXY MOLDING COMPOUND
OERU4100413NO MARK
ContainerTariff Code [Harmonized]WeightValue
OERU41004133214 3184 Kilograms -

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
OOLU2644869340DFDSNKG7012040 () 034EHouse Bill12020-08-17 / 2020-09-25


© 2024 import.report | Privacy Policy