J.bond Technology Co.,ltd → T-mobile C/o Ingram Micro

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by T-MOBILE C/O INGRAM MICRO. This shipment is registered as coming from J.BOND TECHNOLOGY CO.,LTD via Yantian,China (Mainland). Manifest records show a quanitity of 156 CTN with a total weight of 698 Kilograms arrived on 2020-09-01 via the vessel SEASPAN MELBOURNE to the port of Los Angeles, California. Cargo includes products identified as plastic mobile device case.

Cargo Details
Consignee
T-MOBILE C/O INGRAM MICRO
250 HILTON DR
JEFFERSONVILLE IN 47130 US
Shipper
J.BOND TECHNOLOGY CO.,LTD
BUXIN INDUSTIAL AREA,
YANTIANFENGGANG.,DONGGUAN,,523702,C
N
DONGGUAN CN
Vessel and Port
Carrier CodeAIWL
VesselSEASPAN MELBOURNE [HK]
Departure PortYantian,China (Mainland)
Landing PortLos Angeles, California
Manifest Qty156 CTN
Manifest Weight698 Kilograms
Manifest Dimension0 Cubic Meters
Place of ReceiptYANTIAN PT
Conveyance ID9290127 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2020-09-01
Notified Parties
  • ZIMU

Container Cargo Description
Container #PiecesDescription
ZCSU5129897156PLASTIC MOBILE DEVICE CASE
ZCSU5129897N/M
ZCSU5129897N/M
ContainerTariff Code [Harmonized]WeightValue
ZCSU5129897 698 Kilograms -

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
ZIMUSHH30280588AIWLSZX00471654 () 11EHouse Bill12020-08-13 / 2020-09-02


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