Epak Technologies(shenzhen) → Epak International, Inc

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by EPAK INTERNATIONAL, INC. This shipment is registered as coming from EPAK TECHNOLOGIES(SHENZHEN) via Yantian,China (Mainland). Manifest records show a quanitity of 433 CTN with a total weight of 4315 Kilograms arrived on 2020-07-22 via the vessel MAERSK EUREKA to the port of Los Angeles, California. Cargo includes products identified as plastic box hs code:3923.10.2000 149ctns 1674.5kgs 22cbm plastic ring,foam,plastic disk, vacuum tray hs code:3923.90.0080 77ctns 968.4kgs 8cbm vacuum tray hs code:3923.10.9000 all items are plastic packing products for semiconductors shipment contains no solid.

Cargo Details
Consignee
EPAK INTERNATIONAL, INC
4926 SPICEWOOD SPRING,
STE.100 AUSTIN,TX 78759 USA

Shipper
EPAK TECHNOLOGIES(SHENZHEN)
CO.,LTD JIAN LONG INDUSTRIAL
ESTATE, HENG GANG TOWN,
LONG GANG DIST, SZ CN

Notify Party
EPAK INTERNATIONAL, INC
4926 SPICEWOOD SPRING,
STE.100 AUSTIN,TX 78759 USA



Vessel and Port
Carrier CodeHNLT
VesselMAERSK EUREKA [FR]
Departure PortYantian,China (Mainland)
Landing PortLos Angeles, California
Manifest Qty433 CTN
Manifest Weight4315 Kilograms
Manifest Dimension0 Cubic Meters
Place of ReceiptYANTIAN
Conveyance IDMAERSK EUREKA [Conveyance Name]
Transportation ModeVessel, containerized
Arrival Date2020-07-22

Container Cargo Description
Container #PiecesDescription
MEDU4058148433PLASTIC BOX HS CODE:3923.10.2000 149CTNS 1674.5KGS 22CBM PLASTIC RING,FOAM,PLASTIC DISK, VACUUM TRAY HS CODE:3923.90.0080 77CTNS 968.4KGS 8CBM VACUUM TRAY HS CODE:3923.10.9000 ALL ITEMS ARE PLASTIC PACKING PRODUCTS FOR SEMICONDUCTORS SHIPMENT CONTAINS NO SOLID
MEDU4058148EPAK NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS
MEDU4058148EPAK NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
MEDUZH996593HNLTSZ20A09333 () 027NHouse Bill12020-07-02 / 2020-07-23


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