Sebang Express Co.,ltd. → Binexline Corp , Atlanta 2150 Boggs

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by BINEXLINE CORP , ATLANTA 2150 BOGGS. This shipment is registered as coming from SEBANG EXPRESS CO.,LTD. via Pusan,South Korea. Manifest records show a quanitity of 36 PCS with a total weight of 34358 Kilograms arrived on 2020-07-14 via the vessel HYUNDAI SMART to the port of Savannah, Georgia. Cargo includes products identified as forging parts for auto mobile 1.48527 3109s socket-outer,h/f 2.48647 3109s socket-outer,h/f 3.48527 3159s socket-outer,h/f 4.48647 3159s socket-outer,h/f.

Cargo Details
Consignee
BINEXLINE CORP , ATLANTA 2150 BOGGS
ROAD SUITE 120
DULUTH, GA 30096
TEL 404-768-8866 EXT 225
ATTN DAVID LEE

Shipper
SEBANG EXPRESS CO.,LTD.
SEBANG BLDG 5F, 68-46, BUMIL 5DONG,
DONG-GU, BUSAN, KOREA

Notify Party
BINEXLINE CORP , ATLANTA 2150 BOGGS
ROAD SUITE 120
DULUTH, GA 30096
TEL 404-768-8866 EXT 225
ATTN DAVID LEE

Vessel and Port
Carrier CodeHLCU
VesselHYUNDAI SMART [GR]
Departure PortPusan,South Korea
Landing PortSavannah, Georgia
Manifest Qty36 PCS
Manifest Weight34358 Kilograms
Manifest Dimension0
Place of ReceiptBUSAN, KR
Port of DetinationAtlanta, Georgia
Conveyance ID9475686 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2020-07-14

Container Cargo Description
Container #PiecesDescription
FCIU468473018FORGING PARTS FOR AUTO MOBILE 1.48527 3109S SOCKET-OUTER,H/F 2.48647 3109S SOCKET-OUTER,H/F 3.48527 3159S SOCKET-OUTER,H/F 4.48647 3159S SOCKET-OUTER,H/F
GLDU573873918FORGING PARTS FOR AUTO MOBILE 1.48527 3109S SOCKET-OUTER,H/F 2.48647 3109S SOCKET-OUTER,H/F 3.48527 3159S SOCKET-OUTER,H/F 4.48647 3159S SOCKET-OUTER,H/F
FCIU4684730NO MARKS . . . .
FCIU4684730NO MARKS . . . .
GLDU5738739NO MARKS . . . .
GLDU5738739NO MARKS . . . .
ContainerTariff Code [Harmonized]WeightValue
FCIU468473088 0 -
GLDU573873988 0 -

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
HLCUSEL200602008 () 026EMaster BOL w/in-bond12020-07-01 / 2020-07-15


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