Grand Bond Electronics Ltd → Medisim Usa Inc.

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by MEDISIM USA INC.. This shipment is registered as coming from GRAND BOND ELECTRONICS LTD via Hong Kong,Hong Kong. Manifest records show a quanitity of 2085 CTN with a total weight of 4804 Kilograms arrived on 2020-02-26 via the vessel OOCL POLAND to the port of New York/Newark Area, Newark, New Jersey. Cargo includes products identified as thermometer,electronic ,clinical temple touch 02292) fht6c (eqd) rev.2 medisim po 190242 3 0,024 pcs up-grade thermometer upg2w (.

Cargo Details
Consignee
MEDISIM USA INC.
505 CHRISMILL LANE,
HOLLY SPRINGS NC 27540 US
Shipper
GRAND BOND ELECTRONICS LTD
UNIT 2207-8,22/F.,CCT TELECOM
BUILDING 11-19 WO SHING STREET
HONG KONG HK
Vessel and Port
Carrier CodeMIGC
VesselOOCL POLAND [HK]
Departure PortHong Kong,Hong Kong
Landing PortNew York/Newark Area, Newark, New Jersey
Manifest Qty2085 CTN
Manifest Weight4804 Kilograms
Manifest Dimension0
Place of ReceiptHONG KONG HONG KO
Conveyance ID9622588 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2020-02-26
Notified Parties
  • EGLV

Container Cargo Description
Container #PiecesDescription
EITU126620085THERMOMETER,ELECTRONIC ,CLINICAL TEMPLE TOUCH 02292) FHT6C (EQD) REV.2 MEDISIM PO 190242 3 0,024 PCS UP-GRADE THERMOMETER UPG2W (
EITU1266200MINI DIGITAL THERMOMETER (DEVICE LISTING D0 FHT6C (EQD) REV.2 UPG2W (EQP) REV.2 .
EITU1266200MINI DIGITAL THERMOMETER (DEVICE LISTING D0 FHT6C (EQD) REV.2 UPG2W (EQP) REV.2 .

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
EGLV149000129622MIGCSH20010441 () 021EHouse Bill12020-01-17 / 2020-02-27


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