Advanced Semiconductor Engineering → Microchip Technology Incorporated

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by MICROCHIP TECHNOLOGY INCORPORATED. This shipment is registered as coming from ADVANCED SEMICONDUCTOR ENGINEERING via Shilong,China (Taiwan). Manifest records show a quanitity of 1 WDC with a total weight of 800 Kilograms arrived on 2019-12-10 via the vessel YM MUTUALITY to the port of Los Angeles, California. Cargo includes products identified as nextest magnum hd512 testermodel.

Cargo Details
Consignee
MICROCHIP TECHNOLOGY INCORPORATED
2100 W 14TH ST
TEMPE AZ 85281 US

Shipper
ADVANCED SEMICONDUCTOR ENGINEERING
NO.550, CHUNG-HWA RD.,
ZHONGLI DIST.,
TAOYUAN CITY 320 TW

Vessel and Port
Carrier CodeEXDO
VesselYM MUTUALITY [LR]
Departure PortShilong,China (Taiwan)
Landing PortLos Angeles, California
Manifest Qty1 WDC
Manifest Weight800 Kilograms
Manifest Dimension25 Cubic Meters
Place of ReceiptKEELUNG
Conveyance ID9455870 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2019-12-10
Notified Parties
  • EXDO

Container Cargo Description
Container #PiecesDescription
FCIU35128441NEXTEST MAGNUM HD512 TESTERMODEL
FCIU3512844--- PLS SEE ATTACHED LIST ---

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
HLCUTPE191131043EXDO6810742872 () 071EHouse Bill12019-11-21 / 2019-12-18


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