Fsp Technology Inc. → Evga Corporation

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by EVGA CORPORATION. This shipment is registered as coming from FSP TECHNOLOGY INC. via Taipei,China (Taiwan). Manifest records show a quanitity of 1134 CTN with a total weight of 16220 Kilograms arrived on 2019-12-04 via the vessel EVER LIVING to the port of Los Angeles, California. Cargo includes products identified as power supply power cord po 3121004175 4224 4137 4096 hs code 8504 40 20 ocgu2019650 emcuje7658 10plts 350ctns 5 187 50kgs 40 hq eitu1984300 emcuje9018 20plts 784c tns 11 032 51kgs ddp.

Cargo Details
Consignee
EVGA CORPORATION
408 SATURN ST.BREA, CA 92821 USA.
LOS ANGELES, CA CA 92821 US

Shipper
FSP TECHNOLOGY INC.
NO.22 JIANGUO E, RD., TAOYUAN CITY,
TAIWAN
TAIPEI 330 TW

Vessel and Port
Carrier CodeSCNL
VesselEVER LIVING [PA]
Departure PortTaipei,China (Taiwan)
Landing PortLos Angeles, California
Manifest Qty1134 CTN
Manifest Weight16220 Kilograms
Manifest Dimension0 Cubic Meters
Place of ReceiptKEELUNG, TAIWAN
Conveyance IDEVER LIVING [Conveyance Name]
Transportation ModeVessel, containerized
Arrival Date2019-12-04
Notified Parties
  • EGLV

Container Cargo Description
Container #PiecesDescription
EITU1984300784POWER SUPPLY POWER CORD PO 3121004175 4224 4137 4096 HS CODE 8504 40 20 OCGU2019650 EMCUJE7658 10PLTS 350CTNS 5 187 50KGS 40 HQ EITU1984300 EMCUJE9018 20PLTS 784C TNS 11 032 51KGS DDP
OCGU20196503POWER SUPPLY POWER CORD PO 3121004175 4224 4137 4096 HS CODE 8504 40 20 OCGU2019650 EMCUJE7658 10PLTS 350CTNS 5 187 50KGS 40 HQ EITU1984300 EMCUJE9018 20PLTS 784C TNS 11 032 51KGS DDP
EITU1984300EVGA IN DIA LOS ANGELES P NO 1A 10A C NO 1A 350A P NO 1 20 C NO 1 784 MADE IN TAIWAN NO MARKS NO MARKS
OCGU2019650EVGA IN DIA LOS ANGELES P NO 1A 10A C NO 1A 350A P NO 1 20 C NO 1 784 MADE IN TAIWAN NO MARKS NO MARKS

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
EGLV003903027831SCNL1US1911068 () 035EHouse Bill12019-11-15 / 2019-12-05


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