Samsung Electronics Hcmc Ce Complex → Samsung Electronics America, Inc.

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by SAMSUNG ELECTRONICS AMERICA, INC.. This shipment is registered as coming from SAMSUNG ELECTRONICS HCMC CE COMPLEX via Vung Tau,Vietnam. Manifest records show a quanitity of 8 CTN with a total weight of 76 Kilograms arrived on 2019-11-14 via the vessel CMA CGM ORFEO to the port of Los Angeles, California. Cargo includes products identified as valve water; motor ac pump; cover rinse ;wire harness-leakage; assy pcb main;assy hose; assy cover filter; assy panel drawer.

Cargo Details
Consignee
SAMSUNG ELECTRONICS AMERICA, INC.
SEA SVC PLANT
18600 SOUTH BROADWICK STREET
RANCHO DOMINGUEZ CA 90220 US

Shipper
SAMSUNG ELECTRONICS HCMC CE COMPLEX
CO., LTD LOT I-11, D2 ROAD, SAIGON
HIGH-TECH PARK, TANG NHON PHU
B WARD, DIST. 9,HO CHI MINH CITY VN

Vessel and Port
Carrier CodeEXDO
VesselCMA CGM ORFEO [DE]
Departure PortVung Tau,Vietnam
Landing PortLos Angeles, California
Manifest Qty8 CTN
Manifest Weight76 Kilograms
Manifest Dimension1 Cubic Meters
Place of ReceiptHO CHI MINH CITY
Conveyance ID9364992 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2019-11-14
Notified Parties
  • COSU
  • EXDO

Container Cargo Description
Container #PiecesDescription
CSNU68953678VALVE WATER; MOTOR AC PUMP; COVER RINSE ;WIRE HARNESS-LEAKAGE; ASSY PCB MAIN;ASSY HOSE; ASSY COVER FILTER; ASSY PANEL DRAWER
CSNU6895367NO MARKS

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
COSU6222647830EXDO63Z8093346 () 00008House Bill12019-10-25 / 2019-11-15


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