Shenzhen Haiseiwei Technology Co., → General Components International

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by GENERAL COMPONENTS INTERNATIONAL. This shipment is registered as coming from SHENZHEN HAISEIWEI TECHNOLOGY CO., via Yantian,China (Mainland) with logistic notifications handled by ECU USA E COMMERCE TEAM. Manifest records show a quanitity of 157 CTN with a total weight of 3330 Kilograms arrived on 2019-03-15 via the vessel MAERSK SEVILLE to the port of Miami, Florida. Cargo includes products identified as mini car kit integrated circuit component breadboard cable.

Cargo Details
Consignee
GENERAL COMPONENTS INTERNATIONAL
13437 NW 19TH LANE
MIAMI FL 13437 US
Shipper
SHENZHEN HAISEIWEI TECHNOLOGY CO.,
7113, 7TH FLOOR, BLOCK C, SHENFANG
BUILDING, FUTIAN DISTRICT,
SHENZHEN GU CN
Notify Party
ECU USA E COMMERCE TEAM
2401 NW 69TH STREET



MIAMI FL 33147 US
Vessel and Port
Carrier CodeECUW
VesselMAERSK SEVILLE [SG]
Departure PortYantian,China (Mainland)
Landing PortMiami, Florida
Manifest Qty157 CTN
Manifest Weight3330 Kilograms
Manifest Dimension0 Cubic Meters
Place of ReceiptSHENZHEN
Conveyance IDMAERSK SEVILLE [Conveyance Name]
Transportation ModeVessel, containerized
Arrival Date2019-03-15

Container Cargo Description
Container #PiecesDescription
MRKU5907003157MINI CAR KIT INTEGRATED CIRCUIT COMPONENT BREADBOARD CABLE
MRKU5907003HSW

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
SUDUN8KSZ103111XECUWSZPMIA03704 () 905House Bill56132019-01-28 / 2019-03-16


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