Samsung Electronics Hcmc Ce Complex → Samsung Electronics America, Inc.

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by SAMSUNG ELECTRONICS AMERICA, INC.. This shipment is registered as coming from SAMSUNG ELECTRONICS HCMC CE COMPLEX via Vung Tau,Vietnam. Manifest records show a quanitity of 10 CTN with a total weight of 38 Kilograms arrived on 2019-03-13 via the vessel CMA CGM LOIRE to the port of Los Angeles, California. Cargo includes products identified as assy diaphragm assy panel control.

Cargo Details
Consignee
SAMSUNG ELECTRONICS AMERICA, INC.
SEA SVC PLANT
18600 SOUTH BROADWICK STREET
RANCHO DOMINGUEZ CA 90220 US

Shipper
SAMSUNG ELECTRONICS HCMC CE COMPLEX
CO., LTD LOT I-11, D2 ROAD, SAIGON
HIGH-TECH PARK, TANG NHON PHU
B WARD, DIST. 9,HO CHI MINH CITY VN

Vessel and Port
Carrier CodeEXDO
VesselCMA CGM LOIRE [MT]
Departure PortVung Tau,Vietnam
Landing PortLos Angeles, California
Manifest Qty10 CTN
Manifest Weight38 Kilograms
Manifest Dimension1 Cubic Meters
Place of ReceiptHO CHI MINH CITY
Conveyance ID9674531 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2019-03-13
Notified Parties
  • EXDO
  • EXDO

Container Cargo Description
Container #PiecesDescription
TCNU9174457ASSY DIAPHRAGM ASSY PANEL CONTROL
TCNU9174457NO MARKS

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
COSU6204227760EXDO63Z8079760 () 00004House Bill12019-02-22 / 2019-03-14


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