Diamond Electric Mfg. Co.,ltd. → Diamond Electric Mfg. Corporation

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by DIAMOND ELECTRIC MFG. CORPORATION. This shipment is registered as coming from DIAMOND ELECTRIC MFG. CO.,LTD. via Kobe,Japan with logistic notifications handled by SAME AS CONSIGNEE. Manifest records show a quanitity of 755 PCS with a total weight of 26118 Kilograms arrived on 2019-01-18 via the vessel NYK CONSTELLATION to the port of Los Angeles, California. Cargo includes products identified as automotive parts (including hardener) invoice no.ic0353/18uspp epoxy resin(hardener) hs code:2917.20.0000 hs code:2917.20/8311.90/8505.90/ 8511.30/8511.90/8541.10.

Cargo Details
Consignee
DIAMOND ELECTRIC MFG. CORPORATION
ELEANOR PLANT
STATE ROUTE 62 ELEANOR INDUSTRIAL
PARK ELEANOR WEST VIRGINIA 25070

Contact Details: U.S.A [Telephone Number]
Shipper
DIAMOND ELECTRIC MFG. CO.,LTD.
15-27, TSUKAMOTO 1 CHOME,
YODOGAWA-KU, OSAKA, JAPAN 532-0026
TEL:06-6302-8141/

Contact Details: FAX:06-6302-8145 [Telephone Number]
Notify Party
SAME AS CONSIGNEE
X
X



Vessel and Port
Carrier CodeAPLU
VesselNYK CONSTELLATION [MH]
Departure PortKobe,Japan
Landing PortLos Angeles, California
Manifest Qty755 PCS
Manifest Weight26118 Kilograms
Manifest Dimension0 Cubic Meters
Place of ReceiptKOBE
Port of DetinationColumbus, Ohio
Conveyance ID9337626 [IMO Number/Lloyds Number]
Transportation ModeVessel, non-container
Arrival Date2019-01-18

Container Cargo Description
Container #PiecesDescription
APZU4387812489AUTOMOTIVE PARTS (INCLUDING HARDENER) INVOICE NO.IC0353/18USPP EPOXY RESIN(HARDENER) HS CODE:2917.20.0000 HS CODE:2917.20/8311.90/8505.90/ 8511.30/8511.90/8541.10
TGHU4914716266.
APZU4387812DEUS IC0353 POCA VESSEL C/NO.1-52
TGHU4914716.
ContainerTariff Code [Harmonized]WeightValue
APZU4387812 26118 Kilograms 3747
TGHU4914716 26118 Kilograms 3747

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
APLUAQZ0103223 () 0FJ2EIn-bond Automated12019-01-09 / 2019-01-19


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