Samsung Electronics Hcmc Ce Complex → Samsung Electronics America, Inc.

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by SAMSUNG ELECTRONICS AMERICA, INC.. This shipment is registered as coming from SAMSUNG ELECTRONICS HCMC CE COMPLEX via Vung Tau,Vietnam. Manifest records show a quanitity of 1 PKG with a total weight of 26 Kilograms arrived on 2018-07-11 via the vessel CMA CGM LOIRE to the port of Los Angeles, California. Cargo includes products identified as assy drum;.

Cargo Details
Consignee
SAMSUNG ELECTRONICS AMERICA, INC.
SEA SVC PLANT
18600 SOUTH BROADWICK STREET
RANCHO DOMINGUEZ CA 90220 US

Shipper
SAMSUNG ELECTRONICS HCMC CE COMPLEX
CO., LTD LOT I-11, D2 ROAD, SAIGON
HIGH-TECH PARK, TANG NHON PHU
B WARD, DIST. 9,HO CHI MINH CITY VN

Vessel and Port
Carrier CodeEXDO
VesselCMA CGM LOIRE [MT]
Departure PortVung Tau,Vietnam
Landing PortLos Angeles, California
Manifest Qty1 PKG
Manifest Weight26 Kilograms
Manifest Dimension1 Cubic Meters
Place of ReceiptHO CHI MINH CITY
Conveyance ID9674531 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2018-07-11
Notified Parties
  • COSU
  • EXDO

Container Cargo Description
Container #PiecesDescription
DFSU68616481ASSY DRUM;
DFSU6861648NO MARKS

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
COSU6089311800EXDO63Z8073696 () 00002House Bill12018-10-18 / 2018-10-31


© 2024 import.report | Privacy Policy