Grand Bond Electronics Ltd. → Medisim Usa Inc.

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by MEDISIM USA INC.. This shipment is registered as coming from GRAND BOND ELECTRONICS LTD. via Hong Kong,Hong Kong. Manifest records show a quanitity of 347 CTN with a total weight of 774 Kilograms arrived on 2018-08-23 via the vessel TAYMA to the port of New York/Newark Area, Newark, New Jersey. Cargo includes products identified as thermometer, electronic , clinical temple tou .8080.

Cargo Details
Consignee
MEDISIM USA INC.
505 CHRISMILL LANE, HOLY SPRINGS, N
RTH CAROLINA, 27540 USA
HOLY SPRINGS NC 27540
USA

Shipper
GRAND BOND ELECTRONICS LTD.
RM 2208,22/F., CCT TELECOM BUILDING
,11-19 WO SHING STREET, FOTAN,STATI
SHATIN, N.T.
HONG KONG

Vessel and Port
Carrier CodeHGLV
VesselTAYMA [MT]
Departure PortHong Kong,Hong Kong
Landing PortNew York/Newark Area, Newark, New Jersey
Manifest Qty347 CTN
Manifest Weight774 Kilograms
Manifest Dimension0
Place of ReceiptHONG KONG HONG KO
Conveyance ID9525895 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2018-08-23
Notified Parties
  • ONEY

Container Cargo Description
Container #PiecesDescription
TCLU1683363347THERMOMETER, ELECTRONIC , CLINICAL TEMPLE TOU .8080
TCLU1683363CH MINI DIGITAL THERMOMETER HS CODE 9025.19 FHT6C (WG) REV6.0

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
ONEYHKGUE1635902HGLVHHKSE807116 () 003EHouse Bill12018-07-19 / 2018-08-24


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