Samsung Electronics Hcmc Ce Complex → Samsung Electronics America, Inc.

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by SAMSUNG ELECTRONICS AMERICA, INC.. This shipment is registered as coming from SAMSUNG ELECTRONICS HCMC CE COMPLEX via Vung Tau,Vietnam. Manifest records show a quanitity of 4 PKG with a total weight of 346 Kilograms arrived on 2018-06-20 via the vessel APL COLUMBUS to the port of Los Angeles, California. Cargo includes products identified as assy cover tub assy diaphragm.

Cargo Details
Consignee
SAMSUNG ELECTRONICS AMERICA, INC.
SEA SVC PLANT
18600 SOUTH BROADWICK STREET
RANCHO DOMINGUEZ CA 90220 US

Shipper
SAMSUNG ELECTRONICS HCMC CE COMPLEX
CO., LTD LOT I-11, D2 ROAD, SAIGON
HIGH-TECH PARK, TANG NHON PHU
B WARD, DIST. 9,HO CHI MINH CITY VN

Vessel and Port
Carrier CodeEXDO
VesselAPL COLUMBUS [SG]
Departure PortVung Tau,Vietnam
Landing PortLos Angeles, California
Manifest Qty4 PKG
Manifest Weight346 Kilograms
Manifest Dimension7 Cubic Meters
Place of ReceiptHO CHI MINH CITY
Conveyance ID9597525 [IMO Number/Lloyds Number]
Transportation ModeVessel, containerized
Arrival Date2018-06-20
Notified Parties
  • COSU
  • EXDO

Container Cargo Description
Container #PiecesDescription
TEMU81733694ASSY COVER TUB ASSY DIAPHRAGM
TEMU8173369NO MARKS

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
COSU6183260902EXDO63Z8066401 () 00001House Bill12018-06-07 / 2018-07-11


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