The following Bill of Lading record outlines a container shipment imported into the US by QUANTA MANUFACTURING, INC.. This shipment is registered as coming from QUANTA COMPUTER INC via Shanghai ,China (Mainland) with logistic notifications handled by QCH INC.. Manifest records show a quanitity of 836 CTN with a total weight of 15190 Kilograms arrived on 2018-05-19 via the vessel APL BELGIUM to the port of Oakland, California. Cargo includes products identified as erver s2v(w o cpu hdd ram) server s2rf(w o cpu hdd ram)w otran f06 mb w ocpu,w 1250 m.2sata pwr tp m(sp) f08 pcie board(m.2 ssd) assy s p f09 io bd 50g assy(fru:20in1) f06 tpm board assy 36 in 1 f08 tpm bd assy 2.0 bsp f08mbwo c latch(w tda21470 d12 l1) bsp.
Carrier Code | HNLT |
Vessel | APL BELGIUM [SG] |
Departure Port | Shanghai ,China (Mainland) |
Landing Port | Oakland, California |
Manifest Qty | 836 CTN |
Manifest Weight | 15190 Kilograms |
Manifest Dimension | 0 |
Place of Receipt | SHANGHAI |
Conveyance ID | APL BELGIUM [Conveyance Name] |
Transportation Mode | Vessel, containerized |
Arrival Date | 2018-05-19 |
Notified Parties |
|
Container # | Pieces | Description |
---|---|---|
APHU6874587 | 342 | ERVER S2V(W O CPU HDD RAM) SERVER S2RF(W O CPU HDD RAM)W OTRAN F06 MB W OCPU,W 1250 M.2SATA PWR TP M(SP) F08 PCIE BOARD(M.2 SSD) ASSY S P F09 IO BD 50G ASSY(FRU:20IN1) F06 TPM BOARD ASSY 36 IN 1 F08 TPM BD ASSY 2.0 BSP F08MBWO C LATCH(W TDA21470 D12 L1) BSP |
APHU6875475 | 494 | ERVER S2V(W O CPU HDD RAM) SERVER S2RF(W O CPU HDD RAM)W OTRAN F06 MB W OCPU,W 1250 M.2SATA PWR TP M(SP) F08 PCIE BOARD(M.2 SSD) ASSY S P F09 IO BD 50G ASSY(FRU:20IN1) F06 TPM BOARD ASSY 36 IN 1 F08 TPM BD ASSY 2.0 BSP F08MBWO C LATCH(W TDA21470 D12 L1) BSP |
APHU6874587 | N M NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS | |
APHU6875475 | N M NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS |
Master BOL | House BOL | Voyage Number | Bill Type | Manifest # | Update / Run Date |
---|---|---|---|---|---|
APLU104319951 | HNLTSH18A06991 () | 234E | House Bill | 1 | 2018-04-28 / 2018-05-21 |