Micron Memory Japan, Inc. → Applied Materials Inc

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by APPLIED MATERIALS INC. This shipment is registered as coming from MICRON MEMORY JAPAN, INC. via Kobe,Japan. Manifest records show a quanitity of 48 CAS with a total weight of 56380 Kilograms arrived on 2018-02-22 via the vessel NYK DEMETER to the port of Los Angeles, California. Cargo includes products identified as fully automated single wafer multiple chamber metal deposition equipment (app. mfg semiconductor dedives) (8486.20).

Cargo Details
Consignee
APPLIED MATERIALS INC
C/O JAVELIN LOGISTICS
810 WEST HOWARD LANE SUITE 150
AUSTIN TX 78753 US
Shipper
MICRON MEMORY JAPAN, INC.
7-10, YOSHIKAWAKOGYODANCHI
HIGASHIHIROSHIMA HI 739-0198 JP
Vessel and Port
Carrier CodeKWEO
VesselNYK DEMETER [PA]
Departure PortKobe,Japan
Landing PortLos Angeles, California
Manifest Qty48 CAS
Manifest Weight56380 Kilograms
Manifest Dimension0
Place of ReceiptKOBE
Conveyance IDNYK DEMETER [Conveyance Name]
Transportation ModeVessel, containerized
Arrival Date2018-02-22
Notified Parties
  • NYKS

Container Cargo Description
Container #PiecesDescription
CAIU91452028FULLY AUTOMATED SINGLE WAFER MULTIPLE CHAMBER METAL DEPOSITION EQUIPMENT (APP. MFG SEMICONDUCTOR DEDIVES) (8486.20)
NYKU80240135FULLY AUTOMATED SINGLE WAFER MULTIPLE CHAMBER METAL DEPOSITION EQUIPMENT (APP. MFG SEMICONDUCTOR DEDIVES) (8486.20)
NYKU81680737FULLY AUTOMATED SINGLE WAFER MULTIPLE CHAMBER METAL DEPOSITION EQUIPMENT (APP. MFG SEMICONDUCTOR DEDIVES) (8486.20)
NYKU84006145FULLY AUTOMATED SINGLE WAFER MULTIPLE CHAMBER METAL DEPOSITION EQUIPMENT (APP. MFG SEMICONDUCTOR DEDIVES) (8486.20)
TCNU33576778FULLY AUTOMATED SINGLE WAFER MULTIPLE CHAMBER METAL DEPOSITION EQUIPMENT (APP. MFG SEMICONDUCTOR DEDIVES) (8486.20)
TCNU64344427FULLY AUTOMATED SINGLE WAFER MULTIPLE CHAMBER METAL DEPOSITION EQUIPMENT (APP. MFG SEMICONDUCTOR DEDIVES) (8486.20)
TRIU08004123FULLY AUTOMATED SINGLE WAFER MULTIPLE CHAMBER METAL DEPOSITION EQUIPMENT (APP. MFG SEMICONDUCTOR DEDIVES) (8486.20)
TRLU87216755FULLY AUTOMATED SINGLE WAFER MULTIPLE CHAMBER METAL DEPOSITION EQUIPMENT (APP. MFG SEMICONDUCTOR DEDIVES) (8486.20)
CAIU9145202A-MAT
NYKU8024013A-MAT
NYKU8168073A-MAT
NYKU8400614A-MAT
TCNU3357677A-MAT
TCNU6434442A-MAT
TRIU0800412A-MAT
TRLU8721675A-MAT

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
NYKSTY6NW5048300KWEO111043712634 () 057EHouse Bill74732018-02-01 / 2018-02-23


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