Soulbrain Co.,ltd. → Samsung Austin Semiconductor Llc

Bill of Lading Import Record

Summary

The following Bill of Lading record outlines a container shipment imported into the US by SAMSUNG AUSTIN SEMICONDUCTOR LLC. This shipment is registered as coming from SOULBRAIN CO.,LTD. via Pusan,South Korea. Manifest records show a quanitity of 160 PKG with a total weight of 39200 Kilograms arrived on 2019-07-17 via the vessel CMA CGM LA SCALA to the port of Houston, Texas. Cargo includes products identified as hf from soulbrain korea - 0204-005892 hydrofluoric acid hf 49 (sa-x,55gal) -korean origin- hs-code 281111 ..

Cargo Details
Consignee
SAMSUNG AUSTIN SEMICONDUCTOR LLC
12100 SAMSUNG BLVD
AUSTIN TX 78754 US

Shipper
SOULBRAIN CO.,LTD.
34, PANGYO-RO 255BEON-GIL,
SEONGNAM-SI KR

Notify Party
SAMSUNG AUSTIN SEMICONDUCTOR LLC
12100 SAMSUNG BLVD
AUSTIN TX 78754 US



Vessel and Port
Carrier CodeBANQ
VesselCMA CGM LA SCALA [GB]
Departure PortPusan,South Korea
Landing PortHouston, Texas
Manifest Qty160 PKG
Manifest Weight39200 Kilograms
Manifest Dimension0 Cubic Meters
Place of ReceiptBUSAN (EX PUSAN)
Conveyance IDCMA CGM LA SCALA [Conveyance Name]
Transportation ModeVessel, containerized
Arrival Date2019-07-17

Container Cargo Description
Container #PiecesDescription
CMAU5395551HF FROM SOULBRAIN KOREA - 0204-005892 HYDROFLUORIC ACID HF 49 (SA-X,55GAL) -KOREAN ORIGIN- HS-CODE 281111 .
TCNU7786915HF FROM SOULBRAIN KOREA - 0204-005892 HYDROFLUORIC ACID HF 49 (SA-X,55GAL) -KOREAN ORIGIN- PACKING 220KGS NET POWER DRUM
CMAU5395551N M SAS NO.1-160 MADE IN KOREA SCAC BANQ HOUSE SEL6844573 WAYBILL REQUESTED
TCNU7786915N M SAS NO.1-160 MADE IN KOREA NO MARKS NO MARKS NO MARKS NO MARKS
TCNU7786915NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS NO MARKS
TCNU7786915NO MARKS NO MARKS
ContainerTariff Code [Harmonized]WeightValue
CMAU5395551281111 19600 Kilograms -
TCNU7786915281111 19600 Kilograms -

BoL Details
Master BOLHouse BOLVoyage NumberBill TypeManifest #Update / Run Date
CMDUSEL0871116BANQSEL6844573 () 0PG43House Bill12019-06-18 / 2019-07-18


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